Ability to communicate well with peers and supervisors
Ability to lift 30 lbs
High school diploma or equivalent experience
Attention to detail
Manual dexterity and eye hand coordination
Drive to understand and execute processes after initial trainings
Ability to follow verbal procedures and interpret bill of material prints
Ability to work overtime as needed
Teamwork skills
Basic Rohs soldering skills
Able to stand for most of the working shift
Problem solving and critical thinking skills
A strong work ethic
Use of mechanical hand tools and manufacturing equipment such as ultrasonic welders, resistance welders, tig welders and parts cleaners

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Manufacturing Technician - Hiring Now

Microchip Technology

Lawrence, MA 01840

~ 24 min OnsiteHealth InsuranceRetirement Benefit

Excellent manual dexterity and hand-eye coordination
Experience using tweezers, vacuum pencils, etc.
Excellent listening skills
Ability to work in a fast-paced, team-oriented environment
Strong understanding of microelectronics and the ability to work with delicate components
Strong problem-solving skills and attention to detail
Prior success working both individually and in a team environment
Basic computer, math and reading comprehension skills
You must be 18 years old with a high school diploma or GED
Good written and verbal communication skills
Proficiency with automated wire bonding machinery and manual wire bonding techniques
Ability to read, comprehend and follow detailed work specifications
Adaptability to frequent change and improvements
Ability to wear the required Protective Equipment
High school diploma or equivalent
Ability to follow written and verbal direction
U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Excellent visual capability to work with extremely small die, without magnification devices
Ability to multi-task while paying careful attention to detail
Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role
Good communication skills, both written and verbal
Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.
Regular and predictable attendance is essential
Ability to read and interpret technical drawings and process specifications