Warehouse Supervisor

Water Lilies Food, LLC.

Bay Shore, NY 11706

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Staff PCB Designer

TTM Technologies

Farmingdale, NY 11735

~ 23 min OnsiteHealth InsurancePaid Time OffRetirement Benefit

BS or related degree in engineering or a related discipline
Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognition of Foreign Person visitors by badge differentiation; c) understand and follow authorization procedures for bringing foreign visitors into facilities (VAL); d) understand the Export and ITAR requirements for shipments leaving the US; e) manage vendor approvals for ITAR manufacturing and services.
Education: Minimum Associates in Electrical Design/Drafting or BS in Electronic Technology.
Related eCAD training certification/career experience will be considered in lieu of a degreed program with 10 year experience.
Necessary familiarities with electrical design utilizing IPC standards, IAW IPC-2221/3 and associated specs is critical.
Comprehensive understanding of electrical and mechanical engineering design practices related to printed circuit board electrical drafting and fabrication drawing creation experience is essential.
Experience: Minimum of 10 years' experience with primary hands-on demonstrated proficiency of Siemens PAD's (VX2.8 or later), Siemen's Xpedition (VX2.14 or later) and/or Cadence Allegro/OrCAD (17.4 or later) product experience is required.
Product safety and EMI consideration during eCAD layout (UL, CSA, NEBS, Etc.)
Understanding of stack-up materials/construction along with impedance modeling requirements
Standardization of electrical components and eCAD libraries utilizing IPC or vendor specific standards
Demonstrated experience with RF PCB routing complexities. Implement layout rules for RF transmission lines (Micro-strip & Coplanar Waveguide), signal line isolation practices, via fencing & unique RF routing structures
Knowledge and methodology utilizing standard IPC Class III approach to design and manufacturing concerns is also necessary.
Exceedingly experienced with High-Speed PCB Design Constraints: Differential Pairs, Routing Topologies, Controlled Impedance, Length-matched Traces and Delay Tuning
Direct design experience related to multi-layer CCA and Flex PCB technologies
Appropriate understanding of vendor component data sheets for creation of schematic library and/or PCB footprints expected.
Current knowledge of µ-via/HDI layout methodologies and best practices