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Semiconductor Process Engineer

Portland,OR

697 Semiconductor Process Engineer jobs in Portland,OR

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Field Service Engineer II - PVD Semiconductor

Canon U.S.A.

Hillsboro, OR 97124

~ 34 min OnsiteFlexible ScheduleBilingual PreferredEducation AssistanceHealth InsurancePaid Time OffRetirement Benefit

  • 1 to 2 years of related experience
  • Associates degree or equivalent experience required (bachelor's preferred) plus 2-3 years experience
  • Multi chamber cluster systems and robotics experience is highly preferred
  • Ability to understand electrical and mechanical drawings for troubleshooting
  • Experience with PLC and other software applications is a plus
  • Ability to work independently following 3-6 months of on the job training
  • Must have analytical skills for problem analysis and resolution
  • May require upwards of 25% car, air and overnight travel
  • Valid driver's license and acceptable driving record necessary
  • Job will require international travel for training
  • Requires ability to lift approx. 50 lbs.
  • Bilingual Communication skills helpful but not required. (Japanese/English)
  • Occasionally kneeling, crouching, stooping, reaching, pushing, pulling and climbing stairs or ladder
  • The worker is required to have close visual acuity with or without corrective lenses for extensive reading
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Intel Foundry Module Development Engineer

Intel

Portland, OR 97204

HybridUrgently HiringHealth InsurancePaid Time OffRetirement Benefit

  • The candidate must possess a Ph.D. degree in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or a related Scientific STEM (Science Technology Engineering Math) field of study.
  • Plus 7+ years of Semiconductor industry experience.
  • Overlay Development Requirements
  • 7+ years of professional overlay development experience and understanding of process induced overlay impacts
  • Proven experience with integrated process development to co-optimize the process and overlay mark design
  • Proven experience troubleshooting process impacts to overlay mark performance
  • Proven experience driving integrated process change methodologies based on overlay impacts
  • Overlay equipment development and vendor interaction experience is a plus
  • Experience with ASML scanner EUV and DUV platforms is a plus
  • Ability to troubleshoot complex production issues and optimize application performance and reliability
  • Factory Requirements
  • Understanding of modern semiconductor manufacturing processes
  • Working knowledge of how modern lithography equipment operates, including the automation systems used to control it
  • Familiarity with factory automation or manufacturing control systems is a plus
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Advanced Packaging Dry Etch Module Development Engineer

Intel

Portland, OR 97204

OnsiteHealth InsurancePaid Time OffRetirement Benefit

  • Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
  • Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
  • Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
  • Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
  • Experience with plasma etch equipment platforms
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Field Service Engineer Lead - Semiconductor

Canon U.S.A.

Hillsboro, OR 97124

$47.28-$70.80/hr
Flexible Schedule
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Applied Early Career Program - Field Service Engineer

Applied Materials

Hillsboro, OR 97124

Paid Relocation to Hillsboro, OR

Requires TravelUrgently Hiring

  • Associate degree, recent college graduate, military technical training, trade certification, or equivalent hands-on experience
  • Basic mechanical aptitude and interest in technical systems
  • Willingness to learn and read electrical and mechanical schematics
  • Ability to diagnose and solve basic technical problems
  • Strong written and verbal communication skills
  • Basic working knowledge of Microsoft Excel, Word, and PowerPoint
  • Valid driver's license and ability to obtain a passport, if required for travel
  • Ability to meet on-site safety, environmental, and customer requirements
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Principal IC Design Engineer, Analog

MSEI US - Micro Systems Engineering

Lake Oswego, OR 97034

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Hardware Engineer II

APCON

Wilsonville, OR 97070

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Aerospace Manufacturing Engineer

Cascade Engineering Technologies

Canby, OR 97013

$80,000-$120,000/yr
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Manufacturing Engineer

Align Percision

North Plains, OR 97133

~ 38 min Onsite

  • CAM experience (Mastercam/Esprit)
  • Experience with lean manufacturing
  • Knowledge of CNC controls and functions
  • Bachelor's degree with 2-4 years of experience, or a Master's degree with 0-2 years of experience.
  • Proficient in the use of all Microsoft Office programs and Windows operating system
  • Travel Required : Minimal
  • Extended screen time
  • Sitting/standing/walking
  • Potentially long hours
  • Ability to distinguish color
  • Occasional lifting up to 50 pounds
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Applied Early Career Program - Field Service Engineer

Applied Materials

Hillsboro, OR 97124

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