Bachelor's degree in Manufacturing or Industrial Engineering, or a related
Science, Engineering or Mathematics field, plus a minimum of 2 years of
relevant experience; or Master's degree, plus 6 months relevant experience
Applicants selected will be subject to a U.S. Government security
investigation
Must meet eligibility requirements for access to classified
information
U.S.
citizenship is required
Familiarity with MIL-STD-883 and MIL-PRF-38534 standards.
Experienced with production processes including die attach (BESI/MRSI), flip-chip, gold and aluminum ultrasonic wire bonding, and mechanical screening
Materials selection and design for MCM (Multi-Chip Module) manufacturing
Microelectronics packaging design and qualification testing techniques
Proven experience in supporting a manufacturing environment
Proficiency in creating and controlling production processes and documentation
Experience in evaluating and addressing non-conforming materials
Capable of performing equipment-related tasks including installations and maintenance
Demonstrated ability to improve processes in a low rate production setting
Basic CAD skills
Knowledge of cleanroom, ESD, and FOD procedures
